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 NLAS323 Dual SPST Analog Switch, Low Voltage, Single Supply
The NLAS323 is a dual SPST (Single Pole, Single Throw) switch, similar to 1/2 a standard 4066. The device permits the independent selection of 2 analog/digital signals. Available in the US8 package. The use of advanced 0.6 micron CMOS process, improves the RON resistance considerably compared to older higher voltage technologies.
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* * * * * * * * * * *
On Resistance is 20 W Typical at 5.0 V Matching is < 1.0 W Between Sections 2.0 to 6.0 V Operating Range Ultra Low < 5.0 pC Charge Injection Ultra Low Leakage < 1.0 nA at 5.0 V, 25 C Wide Bandwidth > 200 MHz, -3.0 dB 2000 V ESD (Human Body Model) Ron Flatness $6.0 W at 5.0 V US8 Package Independent, Positive Enable Pb-Free Package is Available*
MARKING DIAGRAM
8 8 1 US8 US SUFFIX CASE 493
A4 D
1
A4 = Device Code D = Date Code
PIN ASSIGNMENT
1 2 3 NO1 1 8 VCC 4 5 COM1 2 7 IN1 6 7 8 IN2 3 6 COM2 NO1 COM1 IN2 GND NO2 COM2 IN1 VCC
FUNCTION TABLE
GND 4 5 NO2 On/Off Enable Input L H State of Analog Switch Off On
Figure 1. Pinout
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet.
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
(c) Semiconductor Components Industries, LLC, 2004
1
February, 2004 - Rev. 6
Publication Order Number: NLAS323/D
NLAS323
MAXIMUM RATINGS
Symbol VCC VI VO IIK IOK IO ICC IGND TSTG TL TJ qJA PD MSL FR VESD DC Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Sink Current DC Supply Current per Supply Pin DC Ground Current per Ground Pin Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds Junction Temperature under Bias Thermal Resistance Power Dissipation in Still Air at 85C Moisture Sensitivity Flammability Rating ESD Withstand Voltage Oxygen Index: 28 to 34 Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) (Note 1) VI < GND VO < GND Parameter Value *0.5 to )7.0 *0.5 to )7.0 *0.5 to )7.0 *50 *50 $50 $100 $100 *65 to )150 260 )150 250 250 Level 1 UL 94 V-0 @ 0.125 in > 2000 > 150 N/A V Unit V V V mA mA mA mA mA C C C C/W mW
Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum-rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2-ounce copper trace with no air flow. 2. Tested to EIA/JESD22-A114-A. 3. Tested to EIA/JESD22-A115-A. 4. Tested to JESD22-C101-A.
RECOMMENDED OPERATING CONDITIONS
Symbol VCC VIN VIO VIS TA tr, tf Positive DC Supply Voltage Digital Input Voltage (Enable) Static or Dynamic Voltage Across an Off Switch Analog Input Voltage (NO, COM) Operating Temperature Range, All Package Types Input Rise or Fall Time, (Enable Input) Vcc = 3.3 V + 0.3 V Vcc = 5.0 V + 0.5 V Characteristics Min 2.0 GND GND GND -55 0 0 Max 5.5 5.5 VCC VCC +125 100 20 Unit V V V V C ns/V
NORMALIZED FAILURE RATE
DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES
Junction Temperature 5C 80 90 100 110 120 130 140 Time, Hours 1,032,200 419,300 178,700 79,600 37,000 17,800 8,900 Time, Years 117.8 47.9 20.4 9.4 4.2 2.0 1.0
FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 130C TJ = 120C TJ = 100C TJ = 110C TJ = 90C TJ = 80C 100 TIME, YEARS
1 1 10 1000
Figure 2. Failure Rate vs. Time Junction Temperature
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NLAS323
DC CHARACTERISTICS - Digital Section (Voltages Referenced to GND)
Guaranteed Max Limit Symbol VIH Parameter Minimum High-Level Input Voltage, Enable Inputs Condition VCC 2.0 3.0 4.5 5.5 2.0 3.0 4.5 5.5 VIN = 5.5 V or GND Enable and VIS = VCC or GND 0 V to 5.5 V 5.5 -55 to 255C 1.5 2.1 3.15 3.85 0.5 0.9 1.35 1.65 +0.1 1.0 <855C 1.5 2.1 3.15 3.85 0.5 0.9 1.35 1.65 +1.0 1.0 <1255C 1.5 2.1 3.15 3.85 0.5 0.9 1.35 1.65 +1.0 2.0 Unit V
VIL
Maximum Low-Level Input Voltage, Enable Inputs
V
IIN ICC
Maximum Input Leakage Current, Enable Inputs Maximum Quiescent Supply Current (per package)
mA mA
DC ELECTRICAL CHARACTERISTICS - Analog Section
Guaranteed Max Limit Symbol RON Parameter Maximum On Resistance (Figures 8 - 12) On Resistance Flatness Condition VIN = VIH VIS = VCC to GND IIsI = <10.0mA VIN = VIH IIsI = <10.0 mA VIS = 1 V, 2 V, 3.5 V VIN = VIL VNO = 1.0 V, VCOM = 4.5 V or VCOM = 1.0 V and VNO 4.5 V VIN = VIL VNO = 4.5 V or 1.0 V VCOM = 1.0 V or 4.5 V VCC 3.0 4.5 5.5 4.5 -55 to 255C 45 30 25 4.0 <855C 50 35 30 4.0 <1255C 55 40 35 5.0 Unit W
RFLAT(ON)
W
INO(OFF)
Off Leakage Current, Pin 2 (Figure 3)
5.5
1.0
10
100
nA
ICOM(OFF)
Off Leakage Current, Pin 1 (Figure 3)
5.5
1.0
10
100
nA
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
Guaranteed Max Limit VCC Symbol tON Parameter Turn-On Time Test Conditions RL = 300 W, CL = 35 pF (Figures 4, 5, and 13) (V) 2.0 3.0 4.5 5.5 2.0 3.0 4.5 5.5 -55 to 255C Min Typ 7.0 5.0 4.5 4.5 11.0 7.0 5.0 5.0 Max 14 10 9.0 9.0 22 14 10 10 Min <855C Typ Max 16 12 11 11 24 16 12 12 Min <1255C Typ Max 16 12 11 11 24 16 12 12 Unit ns
tOFF
Turn-Off Time
RL = 300 W, CL = 35 pF (Figures 4, 5, and 13)
ns
Typical @ 25, VCC = 5.0 V CIN CNO or CNC CCOM(OFF) CCOM(ON) Maximum Input Capacitance, Select Input Analog I/O (switch off) Common I/O (switch off) Feedthrough (switch on) 8.0 10 10 20 pF
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NLAS323
ADDITIONAL APPLICATION CHARACTERISTICS (Voltages Referenced to GND Unless Noted)
VCC Symbol BW Parameter Maximum On-Channel -3dB Bandwidth or Minimum Frequency Response Res onse Maximum Feedthrough On Loss Condition VIS = 0 dBm VIS centered between VCC and GND (Figures 6 and 14) VIS = 0 dBm @ 10 kHz VIS centered between VCC and GND (Figure 6) f = 100 kHz VIS = 1.0 V RMS kHz; VIS centered between VCC and GND (Figures 6 and 15) VIS = VCC to GND, FIS = 20 kHz tr = tf = 3.0 ns RIS = 0 W, CL = 1000 pF Q = CL * DVOUT (Figures 6 and 16) FIS = 20 Hz to 1 MHz, RL = Rgen = 600 W, CL = 50 pF F VIS = 3.0 VPP sine wave VIS = 5.0 VPP sine wave (Figure 17) (Fi V 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5 3.0 5.5 Limit 25C 190 200 220 -2 -2 2 -2 -93 Unit MHz
VONL
dB
VISO
Off-Channel Isolation
dB
Q
Charge Injection Enable In ut to Common I/O Input
1.5 3.0
pC C
THD
Total Harmonic Distortion THD + Noise
3.3 5.5
0.3 0.15
%
1.00E+05 1.00E+04 1.00E+03 1.00E+02
LEAKAGE (pA)
1.00E+01 1.00E+00 1.00E-01 1.00E-02 1.00E-03 1.00E-04 1.00E-05 1.00E-06 1.00E-07
ICOM(ON)
ICOM(OFF) INO(OFF) 5 25 45 65 85 105 125 145
-55 -35 -15
TEMPERATURE (C)
Figure 3. Switch Leakage vs. Temperature
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NLAS323
VCC DUT VCC 0.1 mF 300 W NO COM VOUT 35 pF Output VOL tON tOFF Input 0V VOH 90% 90% 50% 50%
Input
Figure 4. tON/tOFF
VCC DUT NO COM 35 pF 300 W VOUT Input
VCC 50% 0V VOH Output 10% VOL 10% tON 50%
Input
tOFF
Figure 5. tON/tOFF
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NLAS323
Reference COM
DUT Transmitted NO
50 W Generator 50 W
Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction. VISO = Off Channel Isolation = 20 Log VONL = On Channel Loss = 20 Log VOUT for VIN at 100 kHz VIN
VOUT for VIN at 100 kHz to 50 MHz VIN
Bandwidth (BW) = the frequency 3.0 dB below VONL
Figure 6. Off Channel Isolation/On Channel Loss (BW)/Crosstalk (On Channel to Off Channel)/VONL
DUT NO COM CL Output VIN
VCC GND
Off VIN
On
Off
DVOUT
Figure 7. Charge Injection: (Q)
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NLAS323
80 70 60 RON (W) 50 RON (W) 40 30 20 10 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 VCOM (VOLTS) VCC = 2.5 VCC = 3.0 VCC = 4.5 10 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 VIS (VOLTS) 125C VCC = 2.0 80 70 60 50 40 30 25C 20 85C -55C
Figure 8. RON vs. VCOM and VCC (@255C)
Figure 9. RON vs. VCOM and Temperature, VCC = 2.0 V
45 40 35 30 RON (W) 25 20 15 10 5 0 0 125C 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 85C -55C 25C RON (W)
30 25 20 15 10 5 0 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3 VCOM (VOLTS) 125C 25C 85C -55C
VCOM (VOLTS)
Figure 10. RON vs. VCOM and Temperature, VCC = 2.5 V
Figure 11. RON vs. VCOM and Temperature, VCC = 3.0 V
35.0 18 16 14 RON (W) 12 10 8 6 4 2 0 0 0.4 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 4 4.4 VCOM (VOLTS) 125C TIME (nS) 85C 30.0 25C -55C 25.0 20.0 15.0 10.0 5.0 tOFF 0.0 2.0 3.0 4.5 VCC (V) 5.0 5.5 tON
Figure 12. RON vs. VCOM and Temperature, VCC = 4.5 V
Figure 13. Switching Time vs. Supply Voltage, T = 255C
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NLAS323
0 10 Bandwidth (On - Loss) OFF ISOLATION (dB/Div) 0
BANDWIDTH (dB/Div)
Phase (Degrees)
5
PHASE (Degrees)
0
-50
VCC = 5.0 V TA = 25C
VCC = 5.0 V TA = 25C
0.01
0.1
1
10
100 300
-100 0.01 0.1 1 FREQUENCY (MHz) 10 100 300
FREQUENCY (MHz)
Figure 14. ON Channel Bandwidth and Phase Shift Over Frequency
Figure 15. Off Channel Isolation
1.60 1.40 1.20 1.00 Q (pC) 0.80 0.60 0.40 0.20 0.00 0.0 VCC = 3.0 V VCC = 5.0 V
100
10 THD (%)
1 3.3 V
0.1 5.5 V 0.01 1.0 2.0 3.6 3.0 VCOM (V) 4.0 4.5 5.0 10 100 1000 10000 100000 1000000 FREQUENCY (Hz)
Figure 16. Charge Injection vs. VCOM
Figure 17. THD vs. Frequency
DEVICE ORDERING INFORMATION
Device Nomenclature Device Order Number NLAS323US NLAS323USG Circuit Indicator NL NL Technology AS AS Device Function 323 323 Package Suffix US US Package US8 US8 (Pb-Free) Shipping 178 mm (7) 3000 / Tape & Reel 178 mm (7) 3000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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NLAS323
PACKAGE DIMENSIONS
US8 US SUFFIX CASE 493-02 ISSUE A
-X- A
8 5
-Y-
J
DETAIL E B L
1
4
R S U C
P
G
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION "A" DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055") PER SIDE. 4. DIMENSION "B" DOES NOT INCLUDE INTER-LEAD FLASH OR PROTRUSION. INTER-LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055") PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076-0.0203 MM. (300-800 "). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED 0.0508 (0.0002 "). MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0_ 6_ 5_ 10 _ 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0_ 6_ 5_ 10 _ 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC
-T-
SEATING PLANE
D 0.10 (0.004)
K
M
0.10 (0.004) T N TXY V
H
R 0.10 TYP
M
F DETAIL E
DIM A B C D F G H J K L M N P R S U V
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NLAS323
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
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NLAS323/D


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